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參數(shù)資料
| 型號(hào)： | TMP03FT9 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Serial Digital Output Thermometers |
| 中文描述： | DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 1.50Cel, ROUND, SURFACE MOUNT |
| 封裝： | TO-92, 3 PIN |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 375K |
| 代理商： | TMP03FT9 |
TMP03/TMP04
REV. 0
–15–
V
CC
EN
74HC4520 #2
Q0 Q1
Q2
Q3
Q0 Q1 Q2
Q3
7
15
9
8
16
2
3
4
5
6
11
12
13 14
EN
10
CLK
CLK
GND
RESET
RESET
1
+5V
+5V
V+
D
OUT
GND
TMP04
1
2
3
1
2
3
4
5
6
74HC08
+5V
V
CC
LE
OUT
GND
74HC373
Q1 Q2 Q3 Q4
Q5 Q6 Q7 Q8
13 14 17 18
10
1
3
4
7
8
20
11
2
5
6
9
12
15
16 19
D1 D2 D3 D4
D5 D6 D7 D8
+5V
V
CC
LE
OUT
GND
74HC373
Q1 Q2 Q3 Q4
Q5 Q6 Q7 Q8
13 14 17 18
10
1
3
4
7
8
20
11
2
5
6
9
12
15
16 19
D1 D2 D3 D4
D5 D6 D7 D8
+5V
V
CC
LE
OUT
GND
74HC373
Q1 Q2 Q3 Q4
Q5 Q6 Q7 Q8
13 14 17 18
10
1
3
4
7
8
20
11
2
5
6
9
12
15
16 19
D1 D2 D3 D4
D5 D6 D7 D8
+5V
V
CC
LE
OUT
GND
74HC373
Q1 Q2 Q3 Q4
Q5 Q6 Q7 Q8
13 14 17 18
10
1
3
4
7
8
20
11
2
5
6
9
12
15
16 19
D1 D2 D3 D4
D5 D6 D7 D8
+5V
GND
74HC4538
T2
T1
CLR
A
Q
B
13
14
10
8
11
16
6
9
12
15
20pF
NC
+5V
V
CC
EN
74HC4520 #1
Q0 Q1
Q2
Q3
Q0 Q1 Q2
Q3
7
15
9
8
16
2
3
4
5
6
11
12
13 14
EN
10
CLK
CLK
GND
RESET
RESET
1
1MHZ
CLOCK
3.9k
+5V
Q
GND
74HC86
4
5
T2
T1
CLR
A
Q
Q
B
3
2
6
8
5
7
4
1
20pF
NC
1k
+5V
V
CC
+5V
10k
10pF
10μF
0.1μF
T1 DATA (MICROSECONDS)
T2 DATA (MICROSECONDS)
Figure 36. A Hardware Interface for the TMP04
Monitoring Electronic Equipment
The TMP03/TMP04 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface mounted package will accurately reflect the exact
thermal conditions which affect nearby integrated circuits. The
TO-92 package, on the other hand, can be mounted above the
surface of the board, to measure the temperature of the air
flowing over the board.
The TMP03 and TMP04 measure and convert the temperature
at the surface of their own semiconductor chip. When the
TMP03/TMP04 are used to measure the temperature of a
nearby heat source, the thermal impedance between the heat
source and the TMP03/TMP04 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source while the TMP03/TMP04
temperature is monitored by measuring T1 and T2. Once the
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP03/TMP04 output.
One example of using the TMP04 to monitor a high power
dissipation microprocessor or other IC is shown in Figure 37.
The TMP04, in a surface mount package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package. In
a typical application, the TMP04’s output would be connected
to an ASIC where the pulse width would be measured (see the
Hardware Interface section of this data sheet for a typical
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