參數(shù)資料
型號(hào): TMDS442PNPG4
廠(chǎng)商: TEXAS INSTRUMENTS INC
元件分類(lèi): 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PQFP128
封裝: GREEN, PLASTIC, TQFP-128
文件頁(yè)數(shù): 31/45頁(yè)
文件大小: 1977K
代理商: TMDS442PNPG4
www.ti.com
Thermal Dissipation
SLLS757A – AUGUST 2006 – REVISED MARCH 2007
High-K board – It is always recommended to solder the PowerPAD onto the thermal land. A thermal land is the
area of solder-tinned-copper underneath the PowerPAD package. Thermal simulation shows the
θJA of the
TMDS442 is 23.2
°C/W on a high-K board with a 4 x 4 thermal via array, or is 29.4°C/W under the same condition
without a via array. The maximum junction temperature is 103
°C with via arrays and 112°C without via arrays
when the maximum power dissipation from the device is 1.43W. The maximum recommended junction
temperature is 125
°C, allowing the TMDS442 to operate over the full temperature range (0°C - 70°C) when the
PowerPAD is soldered onto the thermal land.
Low-K board – Simulation also shows the
θJA of the TMDS442 is 46.9
°C/W on a low-K board with the
PowerPAD soldered and no thermal vias. To ensure the maximum junction temperature does not exceed 125
°C
with a worst case power dissipation from the device of 1.43W, the ambient temperature needs to be lower than
58
°C, when the device is placed on a low-K board.
A general PCB design guide to PowerPAD package is provided in slma002 - PowerPAD Thermally Enhanced
Package.
Copyright 2006–2007, Texas Instruments Incorporated
37
Product Folder Link(s): TMDS442
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