參數(shù)資料
型號(hào): TMC3533
廠商: Fairchild Semiconductor Corporation
元件分類: 8位微控制器
英文描述: ECONOLINE: RSZ/P - 1kVDC
中文描述: ECONOLINE:RSZ / P - 1kVDC 2kVDC隔離UL94V - 0封裝材料所需的散熱片,無外置。組件所需的環(huán)形磁ContinuousShort電路保護(hù)(/ P的后綴)
文件頁(yè)數(shù): 11/12頁(yè)
文件大?。?/td> 68K
代理商: TMC3533
PRODUCT SPECIFICATION
TMC3533
REV. 0.9.1 11/24/99
11
Mechanical Dimensions – 48-pin LQFP Package
D
E1
E
e
PIN 1
IDENTIFIER
B
Base Plane
Seating Plane
See Lead Detail
C
0.063" Ref (1.60mm)
L
-C-
ccc
C
LEAD COPLANARITY
A2
A
A1
α
A
A1
A2
B
D/E
D1/E1
e
L
N
ND
.055
.001
.053
.006
.346
.268
.063
.005
.057
.010
.362
.284
1.40
.05
1.35
.17
8.8
6.8
1.60
.15
1.45
.27
9.2
7.2
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
.019 BSC
.017
48
12
.50 BSC
.45
48
12
.029
.75
6
4
5
2
7
8
α
ccc
0
°
7
°
0
°
7
°
.004
0.08
Notes:
1.
2.
Dimensions "D1" and "E1" do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
Pin 1 identifier is optional.
Dimension ND: Number of terminals.
Dimension ND: Number of terminals per package edge.
"L" is the length of terminal for soldering to a substrate.
Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm. Dambar can not be
located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm
pitch packages.
To be determined at seating place —C—
3.
4.
5.
6.
7.
8.
D1
All dimensions and tolerances conform to ANSI Y14.5M-1982.
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