參數(shù)資料
型號(hào): TLYE1005
廠商: Toshiba Corporation
英文描述: LED Surface Mount Device(表貼型LED)
中文描述: 發(fā)光二極管表面貼裝器件(表貼型發(fā)光二極管)
文件頁(yè)數(shù): 11/11頁(yè)
文件大?。?/td> 659K
代理商: TLYE1005
T O S H IB A C O R P O R A T IO N
11/11
TLG1005, TLGD1005, TLPG1005,
TLOE1005, TLYE1005, TLS1005, TLRA1005
Soldering
1.
Reflow soldering:
* It is recommended to use a reflow furnace of the upper and lower heater type.
* The temperature profile as shown in Fig. 1 is recommended for soldering LEDs by the reflow furnace.
2.
Post solder cleaning:
When cleaning after soldering is needed, the following condition must be adhered to.
– Cleaning solvents: AK225 or Alcohol
– Temperature: 50
°
C (122
°
F) MAX. for 30 seconds, or
30
°
C (86
°
F) MAX. for 3 minutes MAX.
– Ultrasonic: 300W MAX.
Precaution for Mounting
1.
No force to plastic part of LED when LED is under high temperature.
2.
No friction using a hard thing to avoid injuring plastic part of LED.
3.
No contact between LED and the other parts, when installing an assembled board into the set.
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