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參數(shù)資料
| 型號(hào)： | TLV2704IPW |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 比較器 |
| 英文描述： | FAMILY OF NANOPOWER OPERATIONAL AMPLIFIERS AND PUSH-PULL COMPARATORS |
| 中文描述： | 家庭NANOPOWER運(yùn)算放大器和推挽比較器 |
| 文件頁(yè)數(shù)： | 15/23頁(yè) |
| 文件大?。?/td> | 429K |
| 代理商： | TLV2704IPW |
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TLV2702
TLV2704
SLOS340B
–
DECEMBER 2000
–
REVISED AUGUST 2001
15
www.ti.com
APPLICATION INFORMATION
circuit layout considerations
To achieve the levels of high performance of the TLV270x, follow proper printed-circuit board design techniques.
A general set of guidelines is given in the following.
Ground planes
—
It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power supply decoupling
—
Use a 6.8-
μ
F tantalum capacitor in parallel with a 0.1-
μ
F ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-
μ
F ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-
μ
F capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
Sockets
—
Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
Short trace runs/compact part placements
—
Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at
the input of the amplifier.
Surface-mount passive components
—
Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
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| TLV2704IPWR | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述: |
| TLV2711CDBV | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLV2711CDBVR | 功能描述:運(yùn)算放大器 - 運(yùn)放 LP R/R Op Amp. RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2711CDBVRG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 Single LinCMOS Rail-To-Rail uPower RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2711CDBVT | 功能描述:運(yùn)算放大器 - 運(yùn)放 Single LinCMOS R/R RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |