參數(shù)資料
型號： TLV2472CDG4
廠商： TEXAS INSTRUMENTS INC
元件分類： 運算放大器
英文描述： DUAL OP-AMP, 2400 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO8
封裝： GREEN, PLASTIC, SOIC-8
文件頁數(shù)： 1/59頁
文件大?。?/td> 2567K
代理商： TLV2472CDG4
www.ti.com
FEATURES
DESCRIPTION
SLOS232E – JUNE 1999 – REVISED JULY 2007
FAMILY OF 600
μA/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT
HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
CMOS Rail-To-Rail Input/Output
The TLV247x is a family of CMOS rail-to-rail input/
output operational amplifiers that establishes a new
Input Bias Current: 2.5pA
performance point for supply current versus ac
Low Supply Current: 600μA/Channel
performance.
These
devices
consume
just
Ultra-Low Power Shutdown Mode:
600
μA/channel
while
offering
2.8MHz
of
IDD(SHDN): 350nA/ch at 3V
gain-bandwidth product. Along with increased ac
IDD(SHDN): 1000nA/ch at 5V
performance, the amplifier provides high output drive
capability, solving a major shortcoming of older
Gain-Bandwidth Product: 2.8MHz
micropower operational amplifiers. The TLV247x can
High Output Drive Capability:
swing to within 180mV of each supply rail while
–
±10mA at 180mV
driving a 10mA load. For non-RRO applications, the
TLV247x can supply
±35mA at 500mV off the rail.
–
±35mA at 500mV
Both the inputs and outputs swing rail-to-rail for
Input Offset Voltage: 250μV (typ)
increased dynamic range in low-voltage applications.
Supply Voltage Range: 2.7V to 6V
This performance makes the TLV247x family ideal
for sensor interface, portable medical equipment,
Ultra-Small Packaging
and other data acquisition circuits.
–
SOT23-5 or -6 (TLV2470/1)
–
MSOP-8 or -10 (TLV2472/3)
FAMILY PACKAGE TABLE
PACKAGE TYPES
NUMBER OF
DEVICE
SHUTDOWN
UNIVERSAL EVM BOARD
CHANNELS
PDIP
SOIC
SOT23
TSSOP
MSOP
TLV2470
1
8
6
—
Yes
TLV2471
1
8
5
—
TLV2472
2
8
—
8
—
Refer to the EVM Selection
Guide (SLOU060)
TLV2473
2
14
—
10
Yes
TLV2474
4
14
—
14
—
TLV2475
4
16
—
16
—
Yes
A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS(1)
VDD
VIO
BW
SLEW RATE
IDD (per channel)
DEVICE
OUTPUT DRIVE
RAIL-TO-RAIL
(V)
(
μV)
(MHz)
(V/
μs)
(
μA)
TLV247X
2.7 – 6.0
250
2.8
1.5
600
±35mA
I/O
TLV245X
2.7 – 6.0
20
0.22
0.11
23
±10mA
I/O
TLV246X
2.7 – 6.0
150
6.4
1.6
550
±90mA
I/O
TLV277X
2.5 – 6.0
360
5.1
10.5
1000
±10mA
O
(1)
All specifications measured at 5V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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