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參數(shù)資料
| 型號： | TLV2464AQDRQ1 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運動控制電子 |
| 英文描述： | FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| 中文描述： | 家庭的低功耗軌到軌輸入/輸出運算放大器，帶關(guān)斷 |
| 文件頁數(shù)： | 28/33頁 |
| 文件大?。?/td> | 692K |
| 代理商： | TLV2464AQDRQ1 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
2500
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV2460AQDRQ1
ACTIVE
8
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
None
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-220C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
Level-1-250C-UNLIM
TLV2460AQPWRQ1
TLV2460QDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
2500
CU NIPDAU
CU NIPDAU
TLV2460QPWRQ1
TLV2461AQDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
2500
CU NIPDAU
CU NIPDAU
TLV2461AQPWRQ1
TLV2461QDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
2500
CU NIPDAU
CU NIPDAU
TLV2461QPWRQ1
TLV2462AQDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
2500
CU NIPDAU
CU NIPDAU
TLV2462AQPWRQ1
TLV2462QDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
2500
CU NIPDAU
CU NIPDAU
TLV2462QPWRQ1
TLV2463AQDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
2000
2500
CU NIPDAU
CU NIPDAU
14
TLV2463AQPWRQ1
TLV2463QDRQ1
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
14
14
2000
2500
CU NIPDAU
CU NIPDAU
TLV2463QPWRQ1
TLV2464AQPWRQ1
ACTIVE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
2000
2000
CU NIPDAU
CU NIPDAU
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV2464AQPWRG4Q1 | 功能描述:運算放大器 - 運放 Quad Low Pwr R to R Inp/Out Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2464AQPWRQ1 | 功能描述:運算放大器 - 運放 Auto Cat Lo Pwr Rail RailInpt Output RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2464C | 制造商:Texas Instruments 功能描述: |
| TLV2464CD | 功能描述:運算放大器 - 運放 Quad OPAMP Low Power RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2464CDG4 | 功能描述:運算放大器 - 運放 Quad Low Power Rail-to-Rail I/O RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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