參數(shù)資料
型號: TLV2221Y
廠商: Texas Instruments, Inc.
英文描述: Advanced LinCMOSE RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
中文描述: 高級LinCMOSE軌至軌極低功耗的單運算放大器
文件頁數(shù): 3/29頁
文件大?。?/td> 593K
代理商: TLV2221Y
TLV2221, TLV2221Y
Advanced LinCMOS
RAIL-TO-RAIL
VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS157A – JUNE1996 – REVISED JANUARY 1997
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2221Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2221C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (2) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
OUT
IN+
IN–
VDD+
(5)
(1)
(3)
(4)
(2)
VDD–/GND
40
(3)
(2)
(1)
(5)
(4)
32
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