
TLOE50C(F) 
2007-10-01 
1
TOSHIBA InGaA
P LED 
TLOE50C(F)   
○ 
Panel Circuit Indicator 
Lead(Pb)-free products (lead: Sn-Ag-Cu) 
3mm package wide viewing angle 
InGaA
P 
Emitted color: Orange 
Colored, Transparent lens 
Applications: Various types of information panels, indicators for 
amusement equipment and panel backlighting 
illumination sources. 
Absolute Maximum Ratings 
(Ta 
=
 25°C)
CHARACTERISTICS 
SYMBOL
RATING 
UNIT
FORWARD CURRENT 
I
F
50 
mA 
REVERSE VOLTAGE 
V
R
4 
V 
POWER DISSIPATION 
P
D
120 
mW 
OPERATING TEMPERATURE 
T
opr
4
0~100 
°C 
STORAGE TEMPERATURE 
T
stg
40~120 
°C 
Note: Using continuously under heavy loads (e.g. the application of high 
temperature/current/voltage and the significant change in 
temperature, etc.) may cause this product to decrease in the 
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are 
within the absolute maximum ratings. 
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook 
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test 
report and estimated failure rate, etc). 
Electrical and Optical Characteristics
(Ta 
=
 25°C) 
CHARACTERISTICS 
SYMBOL
TEST CONDITION 
MIN 
TYP 
MAX
UNIT
FORWARD VOLTAGE 
V
F
I
F
=20mA 
2.0 
2.4 
V 
REVERSE CURRENT 
I
R
V
R
=4V 
50 
μ
A 
LUMINOUS INTENSITY 
I
V
I
F
=20mA(Note) 
2720 
7000 
mcd
PEAK WAVELENGTH 
λ
P
I
F
=20mA 
(612) 
nm 
SPECTRAL LINE HALF WIDTH 
Δλ
I
F
=20mA 
20 
nm 
DOMINANT WAVELENGTH 
λ
d
I
F
=20mA 
605 
nm 
(Note): Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes 
single Luminous Intensity class. 
U:2720-7360mcd, V:4760-12900mcd, W:8500 mcd –  
Precautions 
Please be careful of the following: 
Soldering temperature: 260°C max, soldering time: 3 s max 
(soldering portion of lead: up to 1.6 mm from the body of the device) 
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to 
the resin. Soldering should be performed after lead forming. 
This visible LED lamp also emits some IR light. 
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light. 
Unit
: mm
JEDEC 
- 
EIAJ 
- 
TOSHIBA 
4
3E1A 
Weight: 0.14 g(Typ.)