參數(shù)資料
型號(hào): TLOE1005
廠商: Toshiba Corporation
英文描述: LED Surface Mount Device(表貼型LED)
中文描述: 發(fā)光二極管表面貼裝器件(表貼型發(fā)光二極管)
文件頁(yè)數(shù): 11/11頁(yè)
文件大小: 659K
代理商: TLOE1005
T O S H IB A C O R P O R A T IO N
11/11
TLG1005, TLGD1005, TLPG1005,
TLOE1005, TLYE1005, TLS1005, TLRA1005
Soldering
1.
Reflow soldering:
* It is recommended to use a reflow furnace of the upper and lower heater type.
* The temperature profile as shown in Fig. 1 is recommended for soldering LEDs by the reflow furnace.
2.
Post solder cleaning:
When cleaning after soldering is needed, the following condition must be adhered to.
– Cleaning solvents: AK225 or Alcohol
– Temperature: 50
°
C (122
°
F) MAX. for 30 seconds, or
30
°
C (86
°
F) MAX. for 3 minutes MAX.
– Ultrasonic: 300W MAX.
Precaution for Mounting
1.
No force to plastic part of LED when LED is under high temperature.
2.
No friction using a hard thing to avoid injuring plastic part of LED.
3.
No contact between LED and the other parts, when installing an assembled board into the set.
相關(guān)PDF資料
PDF描述
TLPG1005 LED Surface Mount Device(表貼型LED)
TLRA1005 LED Surface Mount Device(表貼型LED)
TLS1005 LED Surface Mount Device(表貼型LED)
TLYE1005 LED Surface Mount Device(表貼型LED)
TLG251 TLG251, TLY251, TLO251, TLS251
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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