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參數(shù)資料
| 型號： | TLGD1005 |
| 廠商： | Toshiba Corporation |
| 英文描述： | LED Surface Mount Device(表貼型LED) |
| 中文描述： | 發(fā)光二極管表面貼裝器件（表貼型發(fā)光二極管） |
| 文件頁數(shù)： | 11/11頁 |
| 文件大?。?/td> | 659K |
| 代理商： | TLGD1005 |
T O S H IB A C O R P O R A T IO N
11/11
TLG1005, TLGD1005, TLPG1005,
TLOE1005, TLYE1005, TLS1005, TLRA1005
Soldering
1.
Reflow soldering:
* It is recommended to use a reflow furnace of the upper and lower heater type.
* The temperature profile as shown in Fig. 1 is recommended for soldering LEDs by the reflow furnace.
2.
Post solder cleaning:
When cleaning after soldering is needed, the following condition must be adhered to.
– Cleaning solvents: AK225 or Alcohol
– Temperature: 50
°
C (122
°
F) MAX. for 30 seconds, or
30
°
C (86
°
F) MAX. for 3 minutes MAX.
– Ultrasonic: 300W MAX.
Precaution for Mounting
1.
No force to plastic part of LED when LED is under high temperature.
2.
No friction using a hard thing to avoid injuring plastic part of LED.
3.
No contact between LED and the other parts, when installing an assembled board into the set.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLOE1005 | LED Surface Mount Device(表貼型LED) |
| TLPG1005 | LED Surface Mount Device(表貼型LED) |
| TLRA1005 | LED Surface Mount Device(表貼型LED) |
| TLS1005 | LED Surface Mount Device(表貼型LED) |
| TLYE1005 | LED Surface Mount Device(表貼型LED) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLGD1005A | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:LED LAMP |
| TLGD135AP | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:PANEL CIRCUIT INDICATOR |
| TLGD160 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:PANEL CIRCUIT INDICATOR |
| TLGD175 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:2 CHIP LED LAMP FOR MESSAGE BOARD |
| TLGD231 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:TOSHIBA LED LAMP Gap GREEN LIGHT EMISSION |
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