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參數(shù)資料
| 型號： | TLE6240GP |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | Smart 16-fold Low-Side Switch |
| 中文描述： | 智能16倍的低邊開關(guān) |
| 文件頁數(shù)： | 4/23頁 |
| 文件大?。?/td> | 814K |
| 代理商： | TLE6240GP |
Data Sheet TLE 6240 GP
V3.1
Page
26.Aug 2002
4
Maximum Ratings for T
j
= – 40°C to 150°C
Parameter
Supply Voltage
Continuous Drain Source Voltage (OUT1...OUT16)
Input Voltage, All Inputs and Data Lines
Load Dump Protection
V
Load Dump
=
U
P+
U
S;
U
P=13.5 V
R
I
Channel 1-8 with Automotive Relay
R
L
= 65
Channel 9-16 with Automotive Injector Valve
R
L
= 14
R
I=2
;
t
d=400ms; IN = low or high
Channel 1-8 with Load
R
L
= 24
Channel 9-16 with Load
R
L
= 6.8
Output Current per Channel (see el. characteristics)
Output Current per Channel @
T
A
= 25°C
(All 16 Channels ON; Mounted on PCB )
3
)
Output Current
(Max. total current of all channels on; Heat Sink required)
Single Pulse Inductive Energy (internal clamping)
T
J
= 25°C, I
D1-8
= 0.5 A, I
D9-16
= 1 A
Power Dissipation (DC, mounted on PCB) @
T
A
= 25°C
E
lectro
s
tatic
D
ischarge
V
oltage (Human Body Model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040
IEC Climatic Category, DIN IEC 68-1
Thermal Resistance
junction - case (die soldered on heat slug)
junction - ambient @ min. footprint
junction - ambient @ 6 cm
2
cooling area with heat pipes
Symbol
V
S
V
DS
V
IN
V
Load Dump
Values
Unit
-0.3 ... +7
V
V
V
V
45
- 0.3 ... + 7
1
)=2
;
t
d=400ms; IN = low or high
2
)
90
65
65
50
I
D(lim)
I
D1-8
I
D9-16
I
Dmax
I
D(lim) min
A
A
0.3
0.5
14
A
E
AS
50
mJ
P
tot
V
ESD
3.3
W
V
2000
E
40/150/56
R
thJC
R
thJA
1.5
50
38
K/W
1
)
R
I
=internal resistance of the load dump test pulse generator LD200
2
)
V
is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
3
) Output current rating so long as maximum junction temperature is not exceeded. At
T
A
= 125 °C the output cur-
rent has to be calculated using
R
thJA
according mounting conditions.
PCB with heat pipes,
back side 6 cm
2
cooling area
Minimum footprint
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