參數(shù)資料
型號: TL080CPW
廠商: Texas Instruments, Inc.
英文描述: JFET-INPUT OPERATIONAL AMPLIFIERS
中文描述: JFET輸入運(yùn)算放大器
文件頁數(shù): 5/19頁
文件大?。?/td> 368K
代理商: TL080CPW
TL084Y
JFET-INPUT QUAD OPERATIONAL AMPLIFIER
SLOS081A–D2297, FEBRUARY 1977–REVISED NOVEMBER 1992
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
POST OFFICE BOX 1443
HOUSTON, TEXAS
77251–1443
5
chip information
These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%
ALL DIMENSIONS ARE IN MILS
PIN (11) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
+
1 OUT
1 IN+
1 IN–
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
+
(7)
2 IN+
2 IN–
2 OUT
(11)
VCC–
+
3 OUT
3 IN+
3 IN–
(13)
(10)
(9)
(12)
(8)
+
(14)
4 OUT
4 IN+
4 IN–
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