參數(shù)資料
型號: TL054AMD
廠商: Texas Instruments, Inc.
英文描述: ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強型場效應低失調(diào)運算放大器
文件頁數(shù): 5/65頁
文件大?。?/td> 1022K
代理商: TL054AMD
TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL052Y chip information
This chip, when properly assembled, displays characteristics similar to the TL052. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN+
1IN–
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(4)
VCC–
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
66
72
相關(guān)PDF資料
PDF描述
TL054AMJ ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL054AMN ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL051AMD ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL052MP ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL052Y ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
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