參數(shù)資料
型號: TL052AMFK
廠商: Texas Instruments, Inc.
英文描述: ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強型場效應低失調運算放大器
文件頁數(shù): 6/65頁
文件大?。?/td> 1022K
代理商: TL052AMFK
TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL054 chip information
This chip, when properly assembled, displays characteristics similar to the TL054C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. These chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
+
1OUT
1IN+
1IN–
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(11)
VCC–
+
3OUT
3IN+
3IN–
(13)
(10)
(9)
(12)
(8)
+
(14)
4OUT
4IN+
4IN–
(6)
(7)
(8)
(9)
71
122
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
相關PDF資料
PDF描述
TL054AMFK JT 28C 26#20 2#16 SKT WALL REC
TL054MFK ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL051AMJG ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL051AMP ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL051MD ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
相關代理商/技術參數(shù)
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