參數(shù)資料
    型號(hào): TK11250B
    廠商: TOKO Inc.
    英文描述: VOLTAGE REGULATOR WITH ON/OFF SWITCH
    中文描述: 調(diào)壓器ON / OFF開(kāi)關(guān)
    文件頁(yè)數(shù): 16/24頁(yè)
    文件大?。?/td> 157K
    代理商: TK11250B
    Page 16
    October 1999 TOKO, Inc.
    TK112xxB
    the output side is shorted. Input current gradually falls as
    temperature rises. You should use the value when thermal
    equilibrium is reached.
    The range of usable currents can also be found from the
    graph below.
    Procedure:
    1)
    2)
    3)
    4)
    Find P
    D
    P
    D1
    is taken to be P
    D
    x (~0.8 - 0.9)
    Plot P
    D1
    against 25
    °
    C
    Connect P
    D1
    to the point corresponding to the 150
    °
    C
    with a straight line.
    In design, take a vertical line from the maximum
    operating temperature (e.g., 75
    °
    C) to the derating
    curve.
    Read off the value of P
    D
    against the point at which the
    vertical line intersects the derating curve. This is taken
    as the maximum power dissipation, D
    PD
    .
    5)
    6)
    The maximum operating current is:
    I
    OUT
    = (D
    PD
    / (V
    IN(MAX)
    -
    V
    OUT
    )
    PACKAGE POWER DISSIPATION (P
    D
    )
    This is the power dissipation level at which the thermal
    sensor is activated. The IC contains an internal thermal
    sensor which monitors the junction temperature. When the
    junction temperature exceeds the monitor threshold of
    150
    °
    C, the IC is shut down. The junction temperature
    rises as the difference between the input power (V
    IN
    x I
    IN
    )
    and the output power (V
    OUT
    x I
    OUT
    ) increases. The rate of
    temperature rise is greatly affected by the mounting pad
    configuration on the PCB, the board material, and the
    ambient temperature. When the IC mounting has good
    thermal conductivity, the junction temperature will be low
    even if the power dissipation is great. When mounted on
    the recommended mounting pad, the power dissipation of
    the SOT-23L is increased to 600 mW. For operation at
    ambient temperatures over 25
    °
    C, the power dissipation of
    the SOT-23L device should be derated at 4.8 mW/
    °
    C. The
    power dissipation of the SOT-89 package is 900 mW when
    mounted as recommended. Derate the power dissipation
    at 7.2 mW/
    °
    C for operation above 25
    °
    C. To determine the
    power dissipation for shutdown when mounted, attach the
    device on the actual PCB and deliberately increase the
    output current (or raise the input voltage) until the thermal
    protection circuit is activated. Calculate the power
    dissipation of the device by subtracting the output power
    from the input power. These measurements should allow
    for the ambient temperature of the PCB. The value obtained
    from P
    D
    /(150
    °
    C - T
    A
    ) is the derating factor. The PCB
    mounting pad should provide maximum thermal
    conductivity in order to maintain low device temperatures.
    As a general rule, the lower the temperature, the better the
    reliability of the device. The thermal resistance when
    mounted is expressed as follows:
    T
    j
    = 0
    jA
    x P
    D
    + T
    A
    For Toko ICs, the internal limit for junction temperature is
    150
    °
    C. If the ambient temperature (T
    A
    ) is 25
    °
    C, then:
    150
    °
    C = 0
    jA
    x P
    D
    + 25
    °
    C
    0
    jA
    = 125
    °
    C/ P
    D
    P
    D
    is the value when the thermal sensor is activated. A
    simple way to determine P
    D
    is to calculate V
    IN
    x I
    IN
    when
    DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)
    PD
    DPD
    25
    50
    75
    150
    (mW)
    TA (
    °
    C)
    3
    6
    5
    4
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