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參數(shù)資料
| 型號： | TK11247MBX |
| 廠商： | TOKO INC |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | VOLTAGE REGULATOR WITH ON/OFF SWITCH |
| 中文描述： | 4.75 V FIXED POSITIVE LDO REGULATOR, 0.3 V DROPOUT, PDSO6 |
| 封裝： | SOT-23L, 6 PIN |
| 文件頁數(shù)： | 17/21頁 |
| 文件大?。?/td> | 250K |
| 代理商： | TK11247MBX |
TK112xx
January, 1996 TOKO, Inc.
Page 17
1-3-96
TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)
T
A
= 25
°
C unless otherwise specified.
TK11250 (CONT.)
4.95
5.0
TK112XX TPC38
5.05
VO
–50
T ( C)
80
VIN = 6.0 V
IO = 30 mA
0
50
OUTPUT VOLTAGE vs.
TEMPERATURE
IO = 60 mA
TK112XX TPC37
VIN ( V)
VO
4.5
5.0
5.5
4.0
4.5
OUTPUT VOLTAGE vs.
INPUT VOLTAGE
5.0
IO = 0 mA
TA = 25
°
C
IO = 30 mA
IO = 60 mA
IO = 90 mA
TK112XX TPC36
VIN (V)
II
μ
A
0
10
20
1
INPUT CURRENT vs.
INPUT VOLTAGE
2
0
TA = 25
°
C
IO = 0 mA
DEFINITION AND EXPLANATION OF TECHNICAL TERMS
LINE REGULATION (LINE REG)
Line regulation is the relationship between change in
output voltage due to a change in input voltage.
LOAD REGULATION (LOAD REG)
Load regulation is the relationship between change in
output voltage due to a change in load current.
DROP OUT VOLTAGE (V
DROP
)
This is a measure of how well the regulator performs as the
input voltage decreases. The smaller the number, the
further the input voltage can decrease before regulation
problems occur. Nominal output voltage is first measured
when V
IN
= V
O
+ 1 at a chosen load current. When the
output voltage has dropped 100 mV from the nominal, V
IN
- V
O
is the dropout voltage. This voltage is affected by load
current and junction temperature.
OUTPUT NOISE VOLTAGE
This is the effective AC voltage that occurs on the output
voltage under the condition where the input noise is low and
with a given load, filter capacitor, and frequency range.
THERMAL PROTECTION
This is an internal feature which turns the regulator off when
the junction temperature rises above 150
°
C. After the
regulator turns off, the temperature drops and the regulator
output turns back on. Under certain conditions, the output
waveform may appear to be an oscillation as the output
turns off and on and back again in succession.
PACKAGE POWER DISSIPATION (P
D
)
This is the power dissipation level at which the thermal
sensor is activated. The IC contains an internal thermal
sensor which monitors the junction temperature. When the
junction temperature exceeds the monitor threshold of
150
°
C, the IC is shutdown. The junction temperature rises
as the difference between the input power (V
IN
X I
IN
) and
the output power (V
O
X I
O
) increases. The rate of tempera-
ture rise is greatly affected by the mounting pad configura-
tion on the PCB, the board material, and the ambient
temperature. When the IC mounting has good thermal
conductivity, the junction temperature will be low even if the
power dissipation is great. When mounted onthe recom-
mended mounting pad, the power dissipation of the SOT-
23L is increased to 400 mW. For operation at ambient
temperatures over 25
°
C, the power dissipation of the SOT-
23L device should be derated at 3.2 mW/
°
C. To determine
the power dissipation for shutdown when mounted, attach
the device on the actual PCB and deliberately increase the
output current (or raise the input voltage) until the thermal
protection circuit is activated. Calculate the power dissipa-
tion of the device by subtracting the output power from the
input power. These measurements should allow for the
ambient temperature of the PCB. The value obtained from
PD/(150
°
C - T
A
) is the derating factor. The PCB mounting
pad should provide maximum thermal conductivity in order
to maintain low device temperatures. As a general rule, the
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