參數(shù)資料
型號: TIM1011-2L
廠商: Toshiba Corporation
英文描述: MICROWAVE POWER GaAs FET
中文描述: 微波功率GaAs場效應管
文件頁數(shù): 1/5頁
文件大?。?/td> 144K
代理商: TIM1011-2L
TOSHIBA
MICROWAVE SE MICONDUCTOR
TECHNICAL DATA
MICROWAVE POWER GaAs FET
TIM1011-2L
FEAT URE S
HIGH POWER
BROAD BAND INTERNALLY MATCHED
P1dB=33.5dBm at 10.7GHz to 11.7GHz
HIGH GAIN
HERMETICALLY SEALED PACKAGE
G1dB=7.5dB at 10.7GHz to 11.7GHz
RF PERFORMANCE S PECIFICAT IONS ( T a= 25
°
C )
CHARACTERISTICS
SYMBOL
CONDITION
MIN. TYP. MAX. UNIT
Output Power at 1dB
Compression Point
Power Gain at 1dB
Compression Point
P
1dB
32.5
33.5
dBm
G
1dB
6.5
7.5
dB
Drain Current
I
DS1
η
add
IM
3
-42
0.85
1.1
A
Power Added Efficiency
V
DS
=
9V
f
=10.7-11.7GHz
24
%
3rd Order Intermodulation
Distortion
-45
dBc
Drain Current
I
DS2
Tch
Two Tone Test
P=22dBm
(Single Carrier Level)
0.85
1.1
A
°
C
Channel Temperature Rise
V
DS
X
I
DS
X
R
th(c-c)
80
ELECT RICAL CHARACT ERIS T ICS ( T a= 25
°
C )
CHARACTERISTICS
Transconductance
SYMBOL
gm
CONDITION
V
DS
=
3V
I
DS
=1.0A
V
DS
=
3V
I
DS
= 30mA
V
DS
=
3V
V
GS
= 0V
I
GS
= -30
μ
A
MIN. TYP. MAX. UNIT
600
mS
Pinch-off Voltage
V
GSoff
-2.0
-3.5
-5.0
V
Saturated Drain Current
I
DSS
2.0
2.6
A
Gate-Source Breakdown
Voltage
V
GSO
-5
V
Thermal Resistance
R
th(c-c)
Channel to Case
5.0
6.0
°
C/W
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No
license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
T OS HIBA CORPORAT ION
Apr. 2000
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