參數(shù)資料
型號(hào)： THS7315DR
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 3 CHANNEL, VIDEO AMPLIFIER, PDSO8
封裝： GREEN, PLASTIC, MS-012AA, SOIC-8
文件頁(yè)數(shù)： 12/25頁(yè)
文件大?。?/td> 2376K
代理商： THS7315DR
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
SLOS532 – JUNE 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGING/ORDERING INFORMATION(1)
PACKAGED DEVICES
PACKAGE TYPE
TRANSPORT MEDIA, QUANTITY
THS7315D
Rails, 75
SOIC-8
THS7315DR
Tape and reel, 2500
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted)
THS7315
UNIT
Supply voltage, VS+ to GND
5.5
V
VI
Input voltage
–0.4 to VS+
V
IO
Output current
±90
mA
Continuous power dissipation
TJ
Maximum junction temperature, any condition(2)
+150
°C
TJ
Maximum junction temperature, continuous operation, long term reliability(3)
+125
°C
Tstg
Storage temperature range
–65 to +150
°C
HBM
2000
ESD ratings
CDM
1500
V
MM
200
(1)
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2)
The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3)
The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
POWER RATING(1)
(TJ = +125°C)
θJC
θJA
PACKAGE
(
°C/W)
(
°C/W)
TA = +25°C
TA = +85°C
SOIC-8 (D)
16.8
130(2)
769 mW
308 mW
(1)
Power rating is determined with a junction temperature of +125
°C. This temperature is the point where performance starts to degrade
and long-term reliability starts to be reduced. Thermal management of the final printed circuit board (PCB) should strive to keep the
junction temperature at or below +125
°C for best performance and reliability.
(2)
This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the
θJA is 196°C/W.
MIN
NOM
MAX
UNIT
VS+
Supply voltage
3
5
V
TA
Ambient temperature
–40
+85
°C
2
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