
THS6042, THS6043
350 mA,
±
12 V ADSL CPE LINE DRIVERS
SLOS264G
–
MARCH 2000
–
REVISED DECEMBER 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICE
EVALUATION
MODULES
TA
SOIC-8
(D)
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
TSSOP-14
(PWP)
0
°
C to 70
°
C
THS6042CD
THS6042CDDA
THS6043CD
THS6043CPWP
THS6042EVM
THS6043EVM
–
40
°
C to 85
°
C
THS6042ID
THS6042IDDA
THS6043ID
THS6043IPWP
—
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
CC+
to V
CC
–
Input voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current (see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total power dissipation at (or below) 25
°
C free-air temperature
Operating free-air temperature, T
A
: Commercial
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
: Commercial
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
33 V
±
V
CC
450 mA
±
4 V
150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
See Dissipation Ratings Table
. . . . . . . . . . .
0
°
C to 70
°
C
–
40
°
C to 85
°
C
–
65
°
C to 125
°
C
–
65
°
C to 125
°
C
300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6042 and THS6043 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θ
JA
θ
JC
TA = 25
°
C
TJ = 150
°
C
POWER RATING
1.32 W
2.73 W
1.88 W
3.3 W
D-8
DDA
D-14
PWP
95
°
C/W
45.8
°
C/W
66.6
°
C/W
37.5
°
C/W
38.3
°
C/W
9.2
°
C/W
26.9
°
C/W
1.4
°
C/W
This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test
PCB, the
Θ
JA is168
°
C/W for the D
–
8 package and 122.3
°
C/W for the D
–
14 package.