參數(shù)資料
型號(hào)： THS6007
廠商： Texas Instruments, Inc.
英文描述： Dual Differential Line Drivers and Low-Power Receivers
中文描述： 雙路差動(dòng)線路驅(qū)動(dòng)器和低功耗接收器
文件頁(yè)數(shù)： 29/36頁(yè)
文件大?。?/td> 679K
代理商： THS6007
THS6007
DUAL DIFFERENTIAL LINE DRIVERS AND LOW-POWER RECEIVERS
SLOS334– DECEMBER 2000
29
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
PCB design considerations (continued)
Proper power supply decoupling – Use a minimum of a 6.8-
μ
F tantalum capacitor in parallel with a 0.1-
μ
F
ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several
amplifiers depending on the application, but a 0.1-
μ
F ceramic capacitor should always be used on the
supply terminal of every amplifier. In addition, the 0.1-
μ
F capacitor should be placed as close as possible
to the supply terminal. As this distance increases, the inductance in the connecting etch makes the capacitor
less effective. The designer should strive for distances of less than 0.1 inches between the device power
terminal and the ceramic capacitors.
Because of its power dissipation, proper thermal management of the THS6007 is required. Although there are
many ways to properly heatsink this device, the following steps illustrate one recommended approach for a
multilayer PCB with an internal ground plane.
1.
Prepare the PCB with a top side etch pattern as shown in Figure 86. There should be etch for the leads as
well as etch for the thermal pad.
2.
Place the thermal transfer holes in the area of the thermal pad. These holes should be 13 mils in diameter.
They are kept small so that solder wicking through the holes is not a problem during reflow.
3.
Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps
dissipate the heat generated by the IC. These additional vias may be larger than the 13-mil diameter vias
directly under the thermal pad. They can be larger because they are not in the thermal pad area to be
soldered so that wicking is not a problem.
4.
Connect all holes to the internal ground plane.
5.
When connecting these holes to the ground plane, do
notuse the typical web or spoke via connection
methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the IC package should make their connection to the internal ground plane with a complete
connection around the entire circumference of the plated-through hole.
6.
The top-side solder mask should leave the terminals of the package and the thermal pad area with its
thermal transfer holes exposed. The bottom-side solder mask should cover the thermal transfer holes of
the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the
reflow process.
7.
Apply solder paste to the exposed thermal pad area and all of the IC terminals.
8.
With these preparatory steps in place, the THS6007 IC is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS6007CPWP 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL DIFFERENTIAL LINE DRIVERS AND LOW-POWER RECEIVERS
THS6007IPWP 功能描述:電信線路管理 IC Dual Diff Line Drvr & Lo-Pwr Receivers RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
THS6012 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
THS60121 制造商:Texas Instruments 功能描述:THS60121
THS6012CDWP 功能描述:緩沖器和線路驅(qū)動(dòng)器 500-mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
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