參數(shù)資料
型號(hào): THS6002EVM
廠商: Texas Instruments, Inc.
英文描述: DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
中文描述: 雙差分線路驅(qū)動(dòng)與接收
文件頁(yè)數(shù): 32/40頁(yè)
文件大?。?/td> 718K
代理商: THS6002EVM
THS6002
DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
SLOS202D– JANUARY 1998– REVISED JULY 1999
32
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
PCB design considerations (continued)
Additional 4 vias outside of thermal pad area
but under the package
(Via diameter = 25 mils)
Thermal pad area (0.15 x 0.17) with 5 vias
(Via diameter = 13 mils)
Figure 57. PowerPad PCB Etch and Via Pattern
The actual thermal performance achieved with the THS6002 in its PowerPAD package depends on the
application. In the previous example, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 21.5 C/W. For a given
θ
JA
, the maximum power dissipation
is shown in Figure 58 and is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case (0.37
°
C/W)
θ
CA
= Thermal coefficient from case to ambient
= Maximum power dissipation of THS6002 (watts)
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package.This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
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