- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384975 > THS4500CDGK (Texas Instruments, Inc.) WIDEBAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS PDF資料下載
參數(shù)資料
| 型號(hào)： | THS4500CDGK |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | WIDEBAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS |
| 中文描述： | 寬帶，低失真全差動(dòng)放大器 |
| 文件頁數(shù)： | 2/37頁 |
| 文件大?。?/td> | 585K |
| 代理商： | THS4500CDGK |
第1頁當(dāng)前第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
SLOS350D APRIL 2002 REVISED JANUARY 2004
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
16.5 V
±
V
S
150 mA
Supply voltage, V
S
Input voltage, V
I
Output current, I
O
(2)
Differential input voltage, V
ID
Continuous power dissipation See Dissipation Rating Table
4 V
Maximum junction temperature, T
J (3)
Maximum junction temperature, continuous
operation, long term reliability T
J (4)
150
°
C
125
°
C
Operating free-air temperature
range, T
A
C suffix
0
°
C to 70
°
C
40
°
C to 85
°
C
65
°
C to 150
°
C
I suffix
Storage temperature range, T
stg
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
300
°
C
HBM
4000 V
ESD ratings:
CDM
2000 V
MM
100 V
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)
The THS4500/1 may incorporate a PowerPAD
on the underside
of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI
technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
(3)
The absolute maximum temperature under any condition is
limited by the constraints of the silicon process.
(4)
The maximum junction temperature for continuous operation is
limited by package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
(
°
C/W)
PACKAGE
(
°
C/W)
POWER RATING(2)
TA
≤
25
°
C
1.02 W
θ
JC
θ
JA
(1)
TA = 85
°
C
410 mW
D (8 pin)
38.3
97.5
DGN (8 pin)
4.7
58.4
1.71 W
685 mW
DGK (8 pin)
(1)This data was taken using the JEDEC standard High-K test PCB.
(2)Power rating is determined with a junction temperature of 125
°
C.
This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the
junction temperature at or below 125
°
C for best performance and
long term reliability.
54.2
260
385 mW
154 mW
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
±
5
5
MAX
±
7.5
15
UNIT
Supply voltage
Dual supply
V
Single supply
4.5
Operating free-
air temperature,
T
A
C suffix
0
70
°
C
I suffix
40
85
PACKAGE/ORDERING INFORMATION
ORDERABLE PACKAGE AND NUMBER
PLASTIC MSOP(1)
PowerPad
TEMPERATURE
PLASTIC
SMALL OUTLINE
(D)
PLASTIC MSOP(1)
(DGN)
SYMBOL
BFB
(DGK)
SYMBOL
ATV
0
°
C to 70
°
C
THS4500CD
THS4500CDGN
THS4500CDGK
THS4501CD
THS4501CDGN
BFD
THS4501CDGK
ATW
40
°
C to 85
°
C
THS4500ID
THS4500IDGN
BFC
THS4500IDGK
ASV
THS4501ID
THS4501IDGN
BFE
THS4501IDGK
ASW
(1)All packages are available taped and reeled. The R suffix standard quantity is 2500. The T suffix standard quantity is 250 (e.g., THS4501DT).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS4501CDGK | WIDEBAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS |
| THS4511RGT | WIDEBAND, LOW NOISE, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIER |
| THS4601CDDA | WIDEBAND, FET-INPUT OPERATIONAL AMPLIFIER |
| THS5641ADW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
| THS5641APW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4500CDGKG4 | 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4500CDGKR | 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4500CDGKRG4 | 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4500CDGN | 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4500CDGNG4 | 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。