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| 型號： | THS4140CDGK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | HIGH SPEED FULLY DIFFERENTIAL I/O AMPLIFIERS |
| 中文描述： | 高速全差分的I / O功放 |
| 文件頁數(shù)： | 2/24頁 |
| 文件大小： | 523K |
| 代理商： | THS4140CDGK |
SLOS320E MAY 2000 REVISED JANUARY 2004
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP PowerPAD
(DGN)
THS4140CDGN
EVALUATION
MODULES
TA
SMALL OUTLINE
(D)
MSOP
SYMBOL
AOF
(DGK)
SYMBOL
ATR
0
°
C to 70
°
C
THS4140CD
THS4140CDGK
THS4140EVM
THS4141CD
THS4141CDGN
AOI
THS4141CDGK
ATS
THS4141EVM
40
°
C to 85
°
C
THS4140ID
THS4140IDGN
AOG
THS4140IDGK
ASQ
THS4141ID
THS4141IDGN
AOK
THS4141IDGK
ASR
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC
to V
CC+
Input voltage, V
I
Output current, I
O
(see Note 1)
Differential input voltage, V
ID
Continuous total power dissipation
Maximum junction temperature, T
J
(see Note 2)
Maximum junction temperature, continuous operation, long term reliability, T
J
(see Note 3)
Operating free-air temperature, T
A
:C suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds
ESD ratings:
HBM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CDM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
16.5 V
±
V
CC
150 mA
±
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
See Dissipation Rating Table
150
°
C
125
°
C
. . . . . . . .
0
°
C to 70
°
C
40
°
C to 85
°
C
65
°
C to 150
°
C
300
°
C
2500 V
1500 V
200 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS414x may incorporate a PowerPad
on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad
thermally enhanced package.
NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
DISSIPATION RATING TABLE
PACKAGE
(
°
C/W)
θ
JC
(
°
C/W)
POWER RATING
§
TA = 25
°
C
1.02 W
θ
JA
TA = 85
°
C
410 mW
D
97.5
38.3
DGN
58.4
4.7
1.71 W
685 mW
DGK
260
54.2
385 mW
154 mW
This data was taken using the JEDEC standard HighK test PCB.
§Power rating is determined with a junction temperature of 125
°
C. This is the point where distortion starts to
substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125
°
C for best performance and long term reliability.
recommended operating conditions
MIN
±
2.5
TYP
MAX
±
15
UNIT
Supply voltage, VCC+ to VCC
Dual supply
V
Single supply
5
30
C suffix
0
70
°
C
Operating free-air temperature, T
A
I suffix
40
85
PowerPAD is a trademark of Texas Instruments.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4140CDGKG4 | 功能描述:特殊用途放大器 Fully Diff I/O High Slew Rate RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4140CDGKR | 功能描述:特殊用途放大器 Fully Diff I/O High Slew Rate RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4140CDGKRG4 | 功能描述:特殊用途放大器 Fully Diff I/O High Slew Rate RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4140CDGN | 功能描述:特殊用途放大器 Fully Diff I/O High Slew Rate RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| THS4140CDGNG4 | 功能描述:特殊用途放大器 Fully Diff I/O High Slew Rate RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
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