參數(shù)資料
型號(hào)： THS4052EVM
廠商： Texas Instruments, Inc.
英文描述： 70-MHz HIGH-SPEED AMPLIFIERS
中文描述： 70 - MHz的高速放大器
文件頁數(shù)： 22/30頁
文件大?。?/td> 487K
代理商： THS4052EVM
THS4051, THS4052
70-MHz HIGH-SPEED AMPLIFIERS
SLOS238C– MAY 1999 – REVISED MAY 2000
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS405xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4
°
C/W. For comparison, the non-PowerPAD
version
of the THS405x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 53 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS405x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 53. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD
installation process and thermal management techniques can be
found in the Texas Instruments Technical Brief, PowerPAD
Thermally Enhanced Package.This document can
be found at the TI web site (www.ti.com) by searching on the key word PowerPAD
. The document can also
be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相關(guān)PDF資料
PDF描述
THS4051DGN 70-MHz HIGH-SPEED AMPLIFIERS
THS4051EVM 70-MHz HIGH-SPEED AMPLIFIERS
THS4051FK 70-MHz HIGH-SPEED AMPLIFIERS
THS4051MFK 70-MHz HIGH-SPEED AMPLIFIERS
THS4304DGKR Wideband Operational Amplifier
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS4052ID 功能描述:高速運(yùn)算放大器 Dual 70MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4052IDG4 功能描述:高速運(yùn)算放大器 Dual 70MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4052IDGN 功能描述:高速運(yùn)算放大器 70-MHz Low-Cost Volt-Fdback Amp Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4052IDGNG4 功能描述:高速運(yùn)算放大器 70-MHz Low-Cost Volt-Fdback Amp Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4052IDGNR 功能描述:高速運(yùn)算放大器 70-MHz Low-Cost Volt-Fdback Amp Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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