參數(shù)資料
型號: THS4031ID
廠商: Texas Instruments
文件頁數(shù): 25/47頁
文件大小: 0K
描述: IC OPAMP VFB 100MHZ SGL 8SOIC
標準包裝: 75
放大器類型: 電壓反饋
電路數(shù): 1
轉(zhuǎn)換速率: 100 V/µs
-3db帶寬: 100MHz
電流 - 輸入偏壓: 3µA
電壓 - 輸入偏移: 500µV
電流 - 電源: 8.5mA
電流 - 輸出 / 通道: 90mA
電壓 - 電源,單路/雙路(±): 9 V ~ 32 V,±4.5 V ~ 16 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 管件
產(chǎn)品目錄頁面: 861 (CN2011-ZH PDF)
配用: 296-10029-ND - EVAL MOD FOR THS4031
其它名稱: 296-7522-5
10
100
1000
0
3
6
9
12
15
|V
|-RMSOutputVoltage-V
out
|I
|-MaximumRMSOutputCurrent-mA
out
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
T
=130°C
T =50°C
J
A
DGNPackage
=58.4°C/W
q
JA
MaximumOutput
CurrentLimitLine
V
=±15V
CC
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
MAXIMUMRMSOUTPUTCURRENT
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
vs
0
20
40
60
80
100
120
140
160
180
200
0
1
2
3
4
5
V
=±5V
T =130°C
T =50°C
CC
J
A
SO-8
=121°C/W
High-KTestPCB
q
JA
PackageWith
<=120°C/W
q
JA
SO-8
=167°C/W
Low-KTestPCB
q
JA
|V
|-RMSOutputVoltage-V
out
|I
|MaximumRMSOutputCurrent-mA
out
MaximumOutput
CurrentLimitLine
1
10
100
1000
0
3
6
9
12
15
|I
|-MaximumRMSOutputCurrent-mA
out
|V
|-RMSOutputVoltage-V
out
BothChannels
T
=130°C
T
=50°C
J
A
MaximumOutput
CurrentLimitsLine
THS4032
V
=±15V
CC
DGNPackage
=58.4°C/W
q
JA
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
Safe
Operating
Area
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
0
20
40
60
80
100
120
140
160
180
200
0
1
2
3
4
5
|V
|-RMSOutputVoltage-V
out
|I
|-MaximumRMSOutputCurrent-mA
out
PackageWith
<=60°C/W
q
JA
MaximumOutput
CurrentLimitLine
DGNPackage
=58.4°C/W
q
JA
THS4032
V
=±5V
CC
Safe
Operating
Area
SO-8Package
=167°C/W
Low-KTestPCB
q
JA
SO-8Package
=98°C/W
High-KTestPCB
q
JA
BothChannels
T =130°C
T
=50°C
J
A
MAXIMUMRMSOUTPUTCURRENT
vs
RMSOUTPUTVOLTAGEDUETOTHERMAL LIMITS
www.ti.com
SLOS224G – JULY 1999 – REVISED MARCH 2010
always be soldered to a copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC
package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and copper
area is placed around the device, qJA decreases and the heat dissipation capability increases. The currents and
voltages shown in these graphs are for the total package. For the dual amplifier package (THS4032), the sum of
the RMS output currents and voltages should be used to choose the proper package.
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Copyright 1999–2010, Texas Instruments Incorporated
31
Product Folder Link(s): THS4031 THS4032
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