THS3112
THS3115
SLOS385 SEPTEMBER 2001
2
www.ti.com
AVAILABLE OPTIONS
PACKAGED DEVICE
EVALUATION
TA
SOIC-8
(D)
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
TSSOP-14
(PWP)
EVALUATION
MODULES
0
°C to 70°C
THS3112CD
THS3112CDDA
THS3115CD
THS3115CPWP
THS3112EVM
40
°C to 85°C
THS3112ID
THS3112IDDA
THS3115ID
THS3115IPWP
THS3112EVM
THS3115EVM
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, VCC+ to VCC
33 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage
± VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current (see Note 1)
275 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage
± 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total power dissipation at (or below) 25
°C free-air temperature
See Dissipation Ratings Table
. . . . . . . . . . .
Operating free-air temperature, TA: Commercial
0
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial
40
°C to 85°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg : Commercial
65
°C to 125°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industrial
65
°C to 125°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS3112 and THS3115 may incorporate a PowerPAD
on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θJA
TA = 25°C
POWER RATING
D-8
95
°C/W
1.32 W
DDA
67
°C/W
1.87 W
D-14
66.6
°C/W
1.88 W
PWP
37.5
°C/W
3.3 W
This data was taken using the JEDEC proposed high-K test PCB.
For the JEDEC low-K test PCB, the
θJA is168°C/W for the D-8
package and 122.3
°C/W for the D-14 package.
recommended operating conditions
MIN
NOM
MAX
UNIT
Supply voltage, VCC+ to VCC
Dual supply
±5
±15
V
Supply voltage, VCC+ to VCC
Single supply
10
30
V
Operating free-air temperature, TA
C-suffix
0
70
°C
Operating free-air temperature, TA
I-suffix
40
85
°C
Shutdown pin input levels, relative to the GND pin
High level (device shutdown)
2
V
Shutdown pin input levels, relative to the GND pin
Low level (device active)
0.8
V