參數(shù)資料
型號: THS3115CDR
廠商: TEXAS INSTRUMENTS INC
元件分類: 音頻/視頻放大
英文描述: 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
封裝: GREEN, PLASITC, MS-012AB, SOIC-14
文件頁數(shù): 12/35頁
文件大?。?/td> 1215K
代理商: THS3115CDR
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS(1)
PACKAGED DEVICE
EVALUATION
TA
SOIC-8
SOIC-8 PowerPAD
SOIC-14
TSSOP-14
MODULES
(D)
(DDA)
(D)
(PWP)
0°C to +70°C
THS3112CD
THS3112CDDA
THS3115CD
THS3115CPWP
40°C to +85°C
THS3112ID
THS3112IDDA
THS3115ID
THS3115IPWP
(1)
For the most current specification and package information, refer to the Package Option Addendum located at the end of this data sheet
or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature (unless otherwise noted).
UNIT
Supply voltage, VCC+ to VCC–
33 V
Input voltage
±VCC
Output current (see (2))
275 mA
Differential input voltage
±4 V
Maximum junction temperature
+150°C
Total power dissipation at (or below) +25°C free-air temperature
Commercial
0°C to +70°C
Operating free-air temperature, TA
Industrial
–40°C to +85°C
Commercial
–65°C to +125°C
Storage temperature, Tstg
Industrial
–65°C to +125°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The THS3122 and THS3125 may incorporate a PowerPAD on the underside of the chip. This pad acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD thermally-enhanced package.
DISSIPATION RATINGS TABLE
TA = +25°C
PACKAGE
qJA
POWER RATING
D-8
95°C/W(1)
1.32 W
DDA
67°C/W
1.87 W
D-14
66.6°C/W(1)
1.88 W
PWP
37.5°C/W
3.3 W
(1)
These data were taken using the JEDEC proposed high-K test PCB.
For the JEDEC low-K test PCB, the qJA is 168°C/W for the D-8
package and 122.3°C/W for the D-14 package.
2
Copyright 2001–2010, Texas Instruments Incorporated
Product Folder Link(s): THS3112 THS3115
相關(guān)PDF資料
PDF描述
THS3115CPWPR 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
THS3115IDR 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
THS3115IPWPR 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
THS3115IPWPRG4 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
THS3115CPWPG4 1 CHANNEL, VIDEO AMPLIFIER, PDSO14
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