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參數(shù)資料
| 型號： | THS3112ID |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASITC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 9/35頁 |
| 文件大?。?/td> | 1215K |
| 代理商： | THS3112ID |
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0.205
(5,21)
0.060
(1,52)
0.013
(0,33)
0.017
(0,432)
0.025
(0,64)
0.094
(2,39)
0.040
(1,01)
0.035
(0,89)
0.075
(1,91)
0.010
vias
(0,254)
0.030
(0,76)
Pin1
TopView
P
=
DMax
T
-
max
A
q
JA
www.ti.com
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
PowerPAD Layout Considerations
transfer.
Therefore,
the
holes
under
the
THS3115/THS3112 PowerPAD package should
make the connection to the internal ground plane
with a complete connection around the entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This configuration prevents
solder from being pulled away from the thermal
pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This procedure results
Dimensions are in inches (millimeters).
in a part that is properly installed.
Figure 51. DGN PowerPAD PCB Etch and Via
Power Dissipation and Thermal
Pattern
Considerations
Although there are many ways to properly heatsink
The THS3115 and THS3112 incorporate automatic
the PowerPAD package, the following steps illustrate
thermal shutoff protection. This protection circuitry
the recommended approach.
shuts down the amplifier if the junction temperature
exceeds approximately +160°C. When the junction
1. PCB with a top side etch pattern as shown in
temperature reduces to approximately +140°C, the
amplifier turns on again. However, for maximum
2. Place five holes in the area of the thermal pad.
performance and reliability, the designer must take
These holes should be 0.01 inch (0,254 mm) in
care to ensure that the design does not exceed a
diameter. Keep them small so that solder wicking
junction temperature of +125°C. Between +125°C
through the holes is not a problem during reflow.
and +150°C, damage does not occur, but the
3. Additional vias may be placed anywhere along
performance of the amplifier begins to degrade and
the thermal plane outside of the thermal pad
long-term
reliability
suffers.
The
thermal
area.
These
vias
help
dissipate
the
heat
characteristics of the device are dictated by the
generated by the THS3115/THS3112 IC. These
package and the PCB. Maximum power dissipation
additional vias may be larger than the 0.01-inch
for a given package can be calculated using the
(0,254-mm) diameter vias directly under the
following formula.
thermal pad. They can be larger because they
are not in the thermal pad area to be soldered so
that wicking is not a problem.
4. Connect all holes to the internal ground plane.
where:
Note that the PowerPAD is electrically isolated
PDMax is the maximum power dissipation in the
from the silicon and all leads. Connecting the
amplifier (W)
PowerPAD to any potential voltage, such as VS–,
Tmax is the absolute maximum junction
is acceptable as there is no electrical connection
temperature (°C)
to the silicon.
TA is the ambient temperature (°C)
5. When connecting these holes to the ground
qJA = qJC + qCA
plane, do not use the typical web or spoke via
connection methodology. Web connections have
where:
a high thermal resistance connection that is
qJC is the thermal coefficient from the silicon
useful for slowing the heat transfer during
junctions to the case (°C/W)
soldering operations. This resistance makes the
qCA is the thermal coefficient from the case to
soldering of vias that have plane connections
ambient air (°C/W)
easier. In this application; however, low thermal
resistance is desired for the most efficient heat
Copyright 2001–2010, Texas Instruments Incorporated
17
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| THS3112IDDA | 功能描述:高速運算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112IDDAG3 | 功能描述:高速運算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112IDDAR | 功能描述:高速運算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112IDDARG3 | 功能描述:高速運算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112IDG4 | 功能描述:高速運算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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