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參數(shù)資料
| 型號(hào)： | THS3112CDDAG3 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASTIC, SOP-8 |
| 文件頁數(shù)： | 10/35頁 |
| 文件大?。?/td> | 1215K |
| 代理商： | THS3112CDDAG3 |
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-
40
-
20
0
20
40
60
80
100
T
Free-AirTemperature( C)
-
A
°
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
P
MaximumP
owerDissipation(W)
D
Max
-
T =+125
J
C
°
q
=158
/W
JA
C
°
q
=95
/W
JA
C
°
q
=58.4
/W
JA
C
°
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
www.ti.com
For systems where heat dissipation is more critical,
the THS3115 and THS3112 are also available in an
8-pin MSOP with PowerPAD package that offers
even
better
thermal
performance.
The
thermal
coefficient
for
the
PowerPAD
packages
are
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in
Figure 52 for the available packages. The data for the
PowerPAD packages assume a board layout that
follows the PowerPAD layout guidelines discussed
above and detailed in the PowerPAD application note
(literature
number
also
illustrates the effect of not soldering the PowerPAD to
a
PCB.
The
thermal
impedance
increases
substantially, which may cause serious heat and
performance issues. Always solder the PowerPAD to
Results shown are with no air flow and PCB size of 3 in × 3 in
the PCB for optimum performance.
(76,2 mm × 76,2 mm).
When determining whether or not the device satisfies
qJA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN
the maximum power dissipation requirement, it is
package)
important to not only consider quiescent power
qJA = 95°C/W for 8-pin SOIC High-K test PCB (D package)
dissipation, but also dynamic power dissipation. Often
qJA = 158°C/W for 8-pin MSOP with PowerPAD without solder
times, this type of dissipation is difficult to quantify
Figure 52. Maximum Power Dissipation vs
because the signal pattern is inconsistent, but an
Ambient Temperature
estimate of the RMS power dissipation can provide
visibility into a possible problem.
18
Copyright 2001–2010, Texas Instruments Incorporated
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| THS3112CDDAR | 功能描述:高速運(yùn)算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112CDDARG3 | 功能描述:高速運(yùn)算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112CDG4 | 功能描述:高速運(yùn)算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112CDR | 功能描述:高速運(yùn)算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3112CDRG4 | 功能描述:高速運(yùn)算放大器 Dual Lo-Noise High Output Current RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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