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參數(shù)資料
| 型號： | TG5F-6.4MHZ |
| 廠商： | CONNOR WINFIELD CORP |
| 元件分類： | XO, clock |
| 英文描述： | TCVCXO, CLOCK, 6.4 MHz, HCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC PACKAGE-10 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 296K |
| 代理商： | TG5F-6.4MHZ |
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
Tx180
4 of 4
02
08 Feb 2007
Specifications subject to change without notice. All dimensions in inches. Copyright 1998 The Connor-Winfield Corporation
PACKAGE DRAWING
SUGGESTED PAD LAYOUT
SOLDER PROFILE
120°C
150°C
180°C
260°C
0
220°C
360 Sec. Max.
120 S
Max.
10 S
60 S
Max.
Time
Temperature
260°C
90%
50%
10%
OUTPUT WAVEFORM
Typical Phase Noise
Model T512-010.0MHz
1
Tape and Reel Information
0.276 0.006
(7.0mm)
±
0.197
0.006
(5.0mm)
±
0.079 Max.
(2.0mm)
0.025(6 Places)
(0.635mm)
0.100
(2.54mm)
0.040
(1.02mm)
(6 Places)
0.030
(0.762mm)
(4 Places)
0.100
(2.54mm)
Pin 1
0.038
(0.965mm)
(4 Places)
TA5C 0703
10MHz
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
1
2
3
4
5
6
7
8
9
10
0.215
(5.46mm)
0.037
(0.94mm)
0.051
(1.28mm)
0.051
(1.28mm)
0.295
(7.49mm)
0.030
(0.76mm)
Keep Out Area
Top View
1
Environmental
TABLE 2.4
Vibration:
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Shock:
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
Soldering:
SMD product suitable for Convection Reflow soldering. Peak temperature
260°C. Maximum time above 220°C, 60 seconds.
Solderability
Solderability per Mil Std 883E Method 2003
PACKAG E CHARACTERISTICS
TABLE 1.4
Package
Ceramic Surface Mount Package.
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