參數(shù)資料
型號: TG-NSP25-60
廠商: t-Global Technology
文件頁數(shù): 1/1頁
文件大?。?/td> 0K
描述: SILICONE FREE THERMAL PUTTY 60CC
產(chǎn)品培訓(xùn)模塊: Thermal Interface Product Selection
MSDS 材料安全數(shù)據(jù)表: TG-NSP25 MSDS
標(biāo)準(zhǔn)包裝: 2
系列: TG
類型: 熱油灰
尺寸/尺寸: 60cc 包裝
其它名稱: 1168-1627
TG-NSP25
Preliminary Data Sheet
TG-NSP25 is an ultra conformable silicone-free putty type gap filler. It is designed for when heat
transfer is needed between delicate components where the pressure must be minimised and silicone
contamination cannot be tolerated. TG-NSP25 is designed to fill gaps from 0.25 – 8mm with little or
no stress generated. The non-silicone formulation will adhere to all surfaces, such as metal housings,
ceramic and plastic IC packages and FR4 boards to give a low thermal resistance path for heat transfer.
TG-NSP25 is available in 30cc syringes, 6 and 12oz cartridges and 5 gallon pails.
Description
Property
TG_NSP25
Test Method
Colour
White
-
Description
One part silicone free putty
-
Viscosity /mPas
5,000,000
-
Density / gcm3
2.5
ASTM D792
Thermal Conductivity / W/mk
2.5
ASTM D5470
D4-10 /ppm
0
GC / MS
TML / %
0.2%
ASTM E595
CVCM / %
0.1
ASTM E595
Volume Resistivity / Ohm cm1
1014
Working Temperature / oC
-50 to 150o
Tel: +44 20 8133 2062 Email: sales
@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology
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