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參數(shù)資料
| 型號： | TFP420PAP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, POWER, THERMALLY ENHANCED, PLASTIC, TQFP-64 |
| 文件頁數(shù)： | 10/20頁 |
| 文件大?。?/td> | 253K |
| 代理商： | TFP420PAP |
TFP420
PanelBus
DIGITAL TRANSMITTER
SLDS123A – MARCH 2000 – REVISED JUNE 2000
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PowerPAD
64TQFP package
The TFP420 is packaged in TI’s thermally enhanced PowerPAD
64TQFP packaging. The PowerPAD
package is a 10 mm x 10 mm x 1.4mm TQFP outline with 0.5mm lead-pitch. The PowerPAD
package has a
specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the
same outline. The TI 64TQFP PowerPAD
package offers a backside solder plane that connects directly to the
die mount pad for enhanced thermal conduction. The system designer has the option to solder this backside
plane to a thermal/ ground plane on the PCB. Since the die pad is electrically connected to the TFP420 chip
substrate and hence ground, the backside PowerPAD
connection to a PCB ground plane can improve ground
bounce and power supply noise.
The connection of the PowerPAD
to a PCB thermal/ground plane is optional.
The following table outlines the thermal properties of the TI 64-TQFP PowerPAD
package. The 64-TQFP
non-PowerPAD
package is included only for reference.
TI 64-TQFP (10
× 10 × 1.4 mm)/0.5 mm lead-pitch
PARAMETER
WITHOUT PowerPAD
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
Theta–JA
45
°C/W
27.3
°C/W
17.3
°C/W
Theta–JC
3.11
°C/W
0.12
°C/W
0.12
°C/W
Maximum power dissipation§
1.6 W
2.7 W
4.3 W
Maximum TFP6422 pixel rate
TBD
Specified with 2 oz. Cu PCB plating.
Airflow is at 0 LFM (no airflow)
§ Measured at ambient temperature, TA = 70°C.
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