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參數(shù)資料
| 型號： | TFMM5370 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Photo Modules for PCM Remote Control Systems |
| 中文描述： | 圖片模塊PCM的遠(yuǎn)程控制系統(tǒng) |
| 文件頁數(shù)： | 7/10頁 |
| 文件大?。?/td> | 122K |
| 代理商： | TFMM5370 |
TFMM5..0
Vishay Telefunken
7 (10)
Rev. 3, 14-Sep-00
www.vishay.com
Document Number 82003
Operating Instructions
Reflow Soldering
Reflow soldering must be done within 48 hoursstored
under max. 30
°
C, 80% RH after opening envelop
Recommended soldering paste
(composition: SN 63%, Pb 37%)
Melting temperature 178 to 192
°
C
Apply solder paste to the specified soldering padsus-
ing a dispenser or by screen printing.
Recommended thickness of metal mask is 0.2 mmfor
screen printing.
The recommended reflow furnace is a combination-
type with upper and lowewr heaters.
Set the furnace temperatures for pre-heating and-
heating
in
accordance
temperatureprofile as schown below. Excercise ex-
treme care tokeep the maximum temperature below
230 C. Thefollowing temperature profile means the
temperature at the device surface. Since temperature
difference occurs between the work and the surface of
the circuit board depending on the pes of circuit board
or reflow furnace, the operating conditions should be
verified prior to start of operation.
Handling after reflow should be done only after the
work surface has been cooled off.
with
the
reflow
Manual Soldering
Use the 6/4 solder or the solder containing silver.
Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 C.
Finish soldering within three seconds.
Handle products only after the temperature is cooled
off.
Cleaning
Perform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 m
corresponding to a conductivity of 2 mS/m.
Temperature and time: 30 seconds under the
temperature below 50 C or 3 minutes below 30 C.
Ultrasonic cleaning: Below 20 W.
94 8625
max. 160
°
C
full line
dotted line : process limits
: typical
max. 240
°
C
2–4 K/s
ca. 230
°
C
215
°
C
10 s
50
100
150
200
250
300
0
50
100
150
200
250
Time ( s )
T
°
max. 40 s
Lead Temperature
90 – 120 s
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