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參數(shù)資料
| 型號： | TFBS6711-TR1 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for IrDA Applications |
| 中文描述： | 超薄快速紅外線收發(fā)器（4兆飛行情報區(qū)/秒）為IrDA應(yīng)用 |
| 文件頁數(shù)： | 9/14頁 |
| 文件大?。?/td> | 227K |
| 代理商： | TFBS6711-TR1 |
www.vishay.com
266
Document Number
8
4676
Rev. 1.3, 21-Feb-07
TFBS6711
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS6711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 6 is VISHAY's recommended profiles for use
with the TFBS6711 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/
8
2601/
8
2601.pdf).
Figure 5. Recommended Solder Profile for Sn/Pb soldering
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0
50
100
150
200
250
300
350
Time/s
T
u
r
2...4 °C/s
2...4 °C/s
10 s max. at 230 °C
120 s...180 s
160 °C max.
240 °C max.
90 s max.
19431
Figure 6. Solder Profile, RSS Recommendation
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0
50
100
150
200
250
300
350
Time/s
T
u
r
20 s
2 °C...4 °C/s
2 °C...4 °C/s
90 s...120 s
T
≥
217 °C for 50 s max
Tpeak = 260 °C max.
50 s max.
T
≥
255 °C for 20 s max
19261
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| TFBS6711-TR3 | 功能描述:紅外收發(fā)器 FIR 4Mbit/s 2.4-3.6V Op Voltage RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| TFBS6711-TR4 | 制造商:Vishay Semiconductors 功能描述: 制造商:Vishay Intertechnologies 功能描述:Transceiver Module |
| TFBS6711-TT3 | 功能描述:紅外收發(fā)器 FIR 4Mbit/s 2.4-3.6V Op Voltage RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| TFBS6712 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for IrDA Applications with Low voltage Logic (1.8 V) |
| TFBS6712-TR1 | 制造商:Vishay Intertechnologies 功能描述:4 Mbps 1.8 V 50 cm Side View SMT IrDA Low Profile Fast Infrared Transceiver |
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