參數(shù)資料
型號(hào): TEMT6000
廠商: Vishay Intertechnology,Inc.
英文描述: Ambient Light Sensor, SMD; for Display Backlight Dimming;
中文描述: 環(huán)境光傳感器,貼片,用于顯示背光亮度;
文件頁(yè)數(shù): 3/5頁(yè)
文件大小: 116K
代理商: TEMT6000
VISHAY
TEMT6000
Vishay Semiconductors
Document Number 81579
Rev. 1.2, 08-Jul-04
www.vishay.com
3
Reflow Solder Profiles
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMT6000 is released for:
Moisture Sensitivity Level 4, according to
JEDEC, J-STD-020
Floor Life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h @ 40 °C (+ 5 °C), RH < 5 %
Figure 4. Lead-Free (Sn) Reflow Solder Profile
Figure 5. Lead Tin (SnPb) Reflow Solder Profile
180
20
0
T
°
20s
~
30 s
~
40 s
120 s
~
125 C
°
145 C
°
210 C
°
250 C
°
260 C
°
280
260
240
220
200
180
160
140
120
80
60
40
100
0
60
90
30
150
120
210
240
270
300
Time ( s )
Preheat
Reflow
Cooling
19030
max. 160 C
full line
dotted line : process limits
: typical
Time ( s )
T
Lead Temperature
90 s - 120 s
300
250
200
150
100
50
00
50
100
150
200
250
max. 240 C
ca. 230 C
10 s
215 C
max 40 s
2 K/s - 4 K/s
94 8625
°
°
°
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