參數(shù)資料
型號: TEA5760UK/N1,023
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PBGA25
封裝: 3 X 2.80 MM, 0.60 MM HEIGHT, WLCSP-25
文件頁數(shù): 29/37頁
文件大?。?/td> 209K
代理商: TEA5760UK/N1,023
TEA5760UK_1
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 14 December 2006
34 of 36
NXP Semiconductors
TEA5760UK
Single chip FM stereo radio
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and ux residues
and/or underll removed. When a new chip is placed on the substrate, use the ux
process instead of solder on the solder lands. Apply ux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reow the solder, use the solder prole shown in
Application Note
AN10365 “Surface mount reow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reow soldering.
15. Revision history
Table 33.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA5760UK_1
20061214
Product data sheet
-
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