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參數(shù)資料
| 型號(hào)： | TEA1552 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | GreenChipII SMPS control IC |
| 中文描述： | GreenChipII開關(guān)電源控制IC |
| 文件頁數(shù)： | 19/24頁 |
| 文件大?。?/td> | 119K |
| 代理商： | TEA1552 |
2002 Aug 27
19
Philips Semiconductors
Product specification
GreenChip
II SMPS control IC
TEA1552
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA1552T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GreenChipII SMPS control IC |
| TEA1552T/N1 | 制造商:NXP Semiconductors 功能描述:AC-DC SMPS 14SOIC 制造商:NXP Semiconductors 功能描述:AC-DC, SMPS, 14SOIC |
| TEA1552T/N1,118 | 功能描述:交流/直流開關(guān)轉(zhuǎn)換器 GREENCHIP II SMPS CONTROL IC RoHS:否 制造商:STMicroelectronics 輸出電壓:800 V 輸入/電源電壓（最大值）:23.5 V 輸入/電源電壓（最小值）:11.5 V 開關(guān)頻率:115 kHz 電源電流:1.6 mA 工作溫度范圍:- 40 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SSO-10 封裝:Reel |
| TEA1552T/N1,518 | 功能描述:DC/DC 開關(guān)控制器 GRNCHIP2 SMPS CNTRLR RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| TEA1553T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GreenChip II SMPS control IC |
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