參數(shù)資料
型號(hào)： TEA1507P
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 穩(wěn)壓器
英文描述： GreenChipII SMPS control IC
中文描述： 2 A SWITCHING CONTROLLER, 205 kHz SWITCHING FREQ-MAX, PDIP8
封裝： 0.300 INCH, PLASTIC, DIP-8
文件頁(yè)數(shù)： 17/20頁(yè)
文件大?。?/td> 114K
代理商： TEA1507P
2000 Dec 05
17
Philips Semiconductors
Preliminary specification
GreenChip
II SMPS control IC
TEA1507
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TEA1507P/N1,112 功能描述:轉(zhuǎn)換 - 電壓電平 SMPS GREENCHIP II RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
TEA1520 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:STARplug
TEA1520P 制造商:STMicroelectronics 功能描述:NXP IC 8-PIN DIP
TEA1520P/N2,112 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 POWERPLUG RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TEA1520PN 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 POWERPLUG RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
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