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參數(shù)資料
| 型號： | TDA9898HN/V3 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQCC48 |
| 封裝： | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, MS-026, SOT619-1, HVQFN-48 |
| 文件頁數(shù)： | 103/103頁 |
| 文件大小： | 529K |
| 代理商： | TDA9898HN/V3 |
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TDA9897_TDA9898_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 25 May 2009
99 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
17. Soldering of through-hole mount packages
17.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 54. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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| TDA9897HN/V3 | SPECIALTY CONSUMER CIRCUIT, PQCC48 |
| TDA9898HN/V2 | SPECIALTY CONSUMER CIRCUIT, PQCC48 |
| TDA9898HL/V2/S1 | SPECIALTY CONSUMER CIRCUIT, PQFP48 |
| TDA9897HL/V2/S1 | SPECIALTY CONSUMER CIRCUIT, PQFP48 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9898S1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898V2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9899 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing including car mobile |
| TDA9899HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing including car mobile |
| TDA9899HL/V2,118 | 功能描述:上下轉(zhuǎn)換器 MULTI APPL SYS RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
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