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參數(shù)資料
| 型號(hào)： | TDA9897HL/V2/S1 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT313-2, MS-026, LQFP-48 |
| 文件頁(yè)數(shù)： | 102/103頁(yè) |
| 文件大?。?/td> | 511K |
| 代理商： | TDA9897HL/V2/S1 |
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TDA9897_TDA9898_3
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 11 January 2008
98 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 54.
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16.3.2 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Table 58.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 59.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
MSL: Moisture Sensitivity Level
Fig 54. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| TDA9897HN | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9897HN/V3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9897S1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9897V2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
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