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參數(shù)資料
| 型號： | TDA9818T/V1,118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| 封裝： | 7.50 MM, PLASTIC, SOT-137-1, MS-013, SOP-24 |
| 文件頁數(shù)： | 33/41頁 |
| 文件大?。?/td> | 240K |
| 代理商： | TDA9818T/V1,118 |
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2004 Jun 29
39
Philips Semiconductors
Product specication
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
MOUNTING
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2) DIPPING
Through-hole mount CPGA, HCPGA
suitable
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable(3)
Through-hole-
surface mount
not suitable
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
suitable
PLCC(7), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(7)(8) suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(9)
suitable
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
not suitable
相關PDF資料 |
PDF描述 |
|---|---|
| TDA9819TD-T | SPECIALTY CONSUMER CIRCUIT, PDSO32 |
| TDA9819N | SPECIALTY CONSUMER CIRCUIT, PDIP32 |
| TDA9820N | FM, AUDIO DEMODULATOR, PDIP16 |
| TDA9820TD-T | FM, AUDIO DEMODULATOR, PDSO16 |
| TDA9840N | SPECIALTY CONSUMER CIRCUIT, PDIP20 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9819 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard vision and sound-IF PLL with DVB-IF processing |
| TDA9819T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard vision and sound-IF PLL with DVB-IF processing |
| TDA9820 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard/dual channel TV FM intercarrier sound demodulator |
| TDA9820T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard/dual channel TV FM intercarrier sound demodulator |
| TDA9820T/V1,112 | 制造商:NXP Semiconductors 功能描述:MULTISTD TV FM SOUND DEMOD - Rail/Tube |
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