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參數(shù)資料
| 型號： | TDA8771A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Triple 8-bit video Digital-to-Analog Converter DAC |
| 中文描述： | 三8位視頻數(shù)字模擬轉(zhuǎn)換器數(shù)模轉(zhuǎn)換器 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 134K |
| 代理商： | TDA8771A |
1996 Jan 25
15
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook”(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
Wave soldering
Wave soldering is
not
recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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PDF描述 |
|---|---|
| TDA8772 | Triple 8-bit video digital-to-analog converter |
| TDA8772H | Triple 8-bit video digital-to-analog converter |
| TDA8775 | Triple 10-bit Video Digital-To-Analog Converter (DAC)(三通道10位數(shù)模轉(zhuǎn)換器) |
| TDA8776A | 10-bit, 1000 Msps Digital-to-Analog Converter DAC |
| TDA8776 | 10-bit, 500 Msps Digital-to-Analog Converter (DAC)(10位500 Msps數(shù)模轉(zhuǎn)換器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8771AH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple 8-bit video Digital-to-Analog Converter DAC |
| TDA8771AH/C1,551 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC TRIPLE 8-BIT VIDEO D-TO-A CONV RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TDA8771AH/C1,557 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC TRIPLE 8-BIT VIDEO D-TO-A CONV RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TDA8771H | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Video DAC without Color Palette |
| TDA8772 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple 8-bit video digital-to-analog converter |
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