參數(shù)資料
型號(hào)： TDA8754HL/17
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, LOW PROFILE, PLASTIC, SOT-486-1, MS-026, QFP-144
文件頁(yè)數(shù)： 48/57頁(yè)
文件大?。?/td> 264K
代理商： TDA8754HL/17
9397 750 14984
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2005
52 of 57
Philips Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msps
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
16.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215
°Cto270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
相關(guān)PDF資料
PDF描述
TDA8754EL/17/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754EL/14/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754EL/21/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754HL/17/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754HL/21/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
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TDA8754HL17BE-S 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL17BE-T 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO A/D-170 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL21BE-S 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL21BE-T 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO A/D-210 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL27BE-S 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO A/D-270 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
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