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參數(shù)資料
| 型號： | TDA8591J/N1,112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 47 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM27 |
| 封裝： | PLASTIC, DIL-BENT-SIL, 27 PIN |
| 文件頁數(shù)： | 26/36頁 |
| 文件大?。?/td> | 295K |
| 代理商： | TDA8591J/N1,112 |
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2002 Jan 14
32
Philips Semiconductors
Preliminary specication
4
× 44 W into 4 or 4 × 75 W into 2
quad BTL car radio power amplier
TDA8591J
16 SOLDERING
16.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
“Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
16.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
16.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
16.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TDA8594 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 X 50 W power amplifier |
| TDA8594J | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 X 50 W power amplifier |
| TDA8594J/N1 | 功能描述:音頻放大器 AMPLIFIER 4X50W RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8594J/N1,112 | 制造商:NXP Semiconductors 功能描述: |
| TDA8594J/N1S | 功能描述:音頻放大器 PWR AMP 4x50W RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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