參數資料
型號： TDA8588J
廠商： NXP SEMICONDUCTORS
元件分類： 消費家電
英文描述： I2C-bus controlled 4 x 50 Watt power amplifier and multiple voltage regulator
中文描述： SPECIALTY CONSUMER CIRCUIT, PZFM37
封裝： PLASTIC, SOT725-1, 37 PIN
文件頁數： 51/54頁
文件大小： 283K
代理商： TDA8588J
2004 Feb 24
51
Philips Semiconductors
Product specification
I
2
C-bus controlled 4
×
50 Watt power
amplifier and multiple voltage regulator
TDA8588J; TDA8588xJ
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°
C or 265
°
C, depending on solder
material applied, SnPb or Pb-free respectively.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Notes
1.
2.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
(2)
suitable
suitable
(1)
not suitable
相關PDF資料
PDF描述
TDA8722M I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722 IIC-bus programmable modulator for negative video modulation and FM sound(負向視頻調制和調頻聲的IIC總線可編程調制器)
TDA8722T I2C-bus programmable modulator for negative video modulation and FM sound
TDA8725T Antenna signal processor
TDA8730 PLL FM demodulator for DBS signals
相關代理商/技術參數
參數描述
TDA8588J/N3 功能描述:音頻放大器 MULTI CHIP MODULE IPAS2.50 RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8588J/N3,112 功能描述:音頻放大器 MULTI CHIP MODULE RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8589AJ 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 45 Watt power amplifier and multiple voltage regulator
TDA8589AJ/N3 功能描述:音頻放大器 POWER AMPL + STABI RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8589AJ/N3,112 功能描述:音頻放大器 POWER AMPL + STABI RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數量 廠商 批號 封裝
添加更多采購

我的聯系方式

*
*
*