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參數(shù)資料
| 型號： | TDA8511 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 4 x 13 W single-ended power amplifiers |
| 中文描述： | 4 × 13 W單端功率放大器 |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 80K |
| 代理商： | TDA8511 |
2000 Mar 10
12
Philips Semiconductors
Preliminary specification
4
×
13 W single-ended power amplifiers
TDA8511J
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TDA8511J | 4 x 13 W single-ended power amplifiers |
| TDA8541 | 1 W BTL audio amplifier |
| TDA8547 | 2 x 1 W BTL audio amplifier with output channel switching |
| TDA8547T | 2 x 1 W BTL audio amplifier with output channel switching |
| TDA8551 | 1 W BTL audio amplifier with digital volume control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8511J | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 x 13 W single-ended power amplifiers |
| TDA8511J/N2 | 制造商:NXP Semiconductors 功能描述:Single-ended poweramplifier,TDA8511J/N2 |
| TDA8511J/N2,112 | 功能描述:音頻放大器 4X13W SE RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8511JU | 功能描述:音頻放大器 4X13W SE RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8512 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier |
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