參數(shù)資料
型號(hào): TDA7851A
廠商: STMICROELECTRONICS
元件分類: 音頻/視頻放大
英文描述: 48 W, 4 CHANNEL, AUDIO AMPLIFIER, ZIP27
封裝: ROHS COMPLIANT, FLEXIWATT-27
文件頁(yè)數(shù): 4/15頁(yè)
文件大小: 203K
代理商: TDA7851A
Application hints
TDA7851A
Doc ID 17715 Rev 1
4
Application hints
4.1
DC offset detector
The TDA7851A integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating.
The feature works with the amplifier unmuted and no signal at the inputs.
4.2
SVR
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF
time sequence and, consequently, plays an essential role in the pop optimization during
ON/OFF transients. To conveniently serve both needs, its minimum recommended value
is 10 F.
4.3
Input stage
The TDA7851A's inputs are ground-compatible and can stand very high input signals
(± 8 Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1F) is adopted, the low frequency cut-off
amounts to 16 Hz.
The input capacitors should be 1/4 of the capacitor connected to AC-GND pin for optimum
pop performance.
4.4
Standby and muting
Standby and muting facilities are both CMOS-compatible. In absence of true CMOS ports or
microprocessors, a direct connection to Vs of these two pins is admissible but a 470 k
Ω
equivalent resistance should present between the power supply and the muting and stand-
by pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the standby, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5 V/ms.
4.5
Heatsink definition
Under normal usage (4
Ω speakers) the heatsink's thermal requirements have to be
deduced from Figure 16, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case)
causes Pdiss = 26 W. Assuming Tamb = 70° C and TCHIP = 150 °C as boundary conditions,
the heatsink's thermal resistance should be approximately 2 °C/W. This would avoid any
thermal shutdown occurrence even after long-term and full-volume operation.
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