參數(shù)資料
型號(hào)： TDA7056AT/N2
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 音頻控制
英文描述： 1 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO20
封裝： PLASTIC, SOT-163, SO-20
文件頁(yè)數(shù)： 7/22頁(yè)
文件大小： 164K
代理商： TDA7056AT/N2
1998 Feb 23
15
Philips Semiconductors
Product specication
3 W mono BTL audio amplier with DC
volume control
TDA7056AT
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Reow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°C within
6 seconds. Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°C.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA7056B 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:5 W mono BTL audio amplifier with DC volume control
TDA7056B/N1 制造商:NXP Semiconductors 功能描述:AMP AUDIO 5.5W MONO AB 9SIL 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 5.5W, MONO, AB, 9SIL
TDA7056B/N1,112 功能描述:音頻放大器 5W BTL MONO PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA7056B/N1112 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 3.5W SIP-9
TDA7057 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:2*8W stereo BTL audio output amplifier with DC volume control
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