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參數(shù)資料
| 型號(hào)： | TDA1521Q |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2 x 12 W hi-fi audio power amplifier |
| 中文描述： | 12 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP9 |
| 封裝： | POWER, PLASTIC, SOT-157, SIL-BENT-DIL, 9 PIN |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 150K |
| 代理商： | TDA1521Q |
July 1994
5
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.2 Power derating curve.
THERMAL RESISTANCE
HEATSINK DESIGN EXAMPLE
With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows:
given R
L
= 8
and V
P
=
±
16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature
of 65
°
C, the required thermal resistance of the heatsink is
65
–
14 6
Note: The internal metal block (heatsink) has the same potential as pin 5 (
V
P
).
From junction to case
R
th j-c
= 2,5 K/W
R
th h
a
–
150
2 5
,
3 3 K W
,
=
–
=
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